标准厚度(mm) |
公 差 |
0.01 |
±0.002 |
0.025 |
±0.0025 |
0.03 |
±0.002-0.003 |
0.05 |
±0.005 |
0.075 |
±0.0075 |
0.1 |
±0.01 |
0.15 |
±0.010 |
0.20 |
±0.010 |
Properties |
Test Items |
Units |
Taimide TH-012 |
Taimide TH-025 |
Taimide TH-050 |
Taimide TH-075 |
Test Condition |
Test Method |
Thickness厚度 |
μm |
12.5 |
25 |
50 |
75 |
- |
- |
properties |
unit |
TH-012 |
TL-012 |
Method |
Thickness |
um |
12.5 |
12.5 |
TMT method |
Young's Modulus |
kgf/mm2 |
340 |
420 |
Properties |
Test method |
Unit |
BK-010 (low gloss) |
BK-012 (low gloss) |
BK-025 (low gloss) |
BK-050 (low gloss) |
BK-075 (low gloss) |
Thickness |
TMT Method |
mil |
0.4 |
0.5 |
1 |
2 |
3 |
properties |
unit |
TH-012 |
TL-012 |
TX-012 |
TX-007 |
Method |
Young's Modulus |
kgf/mm2 |
340 |
420 |
950 |
1000 |
ASTM D 882 |
Pomiran® T |
Pomiran® N |
|
膜厚 (m) Thickness |
12, 25, 38 |
|
推薦線路作法 |
半加成法 (Semi-additive) |
|
CTE (ppm/oC: 100-200oC) |
4 ppm=矽晶圓 |
18 ppm=銅 |
剝離強度 |
○ |
◎ |
型號 |
剝離強度 |
加熱後剝離強度 |
|
電鍍法 |
N |
1.2 |
0.7 |
T |
0.9 |
0.5 |
|
濺鍍法 |
T |
0.8 |
0.6 |
市售濺鍍材料 |
0.6 |
0.2 |