电子绝缘材料进口贸易港资企业
国外绝缘材料代理商Polyimide film Upilex®-S,UPILEX-12.5S,UPILEX-25S ,UPILEX-50S ,UPILEX-75S,UPILEX-125S
聚酰亚胺薄膜(Polyimide Film)是世界上性能好的薄膜类绝缘材料,由均苯四甲酸二酐(PMDA)和二胺基二苯醚(DDE)在强极性溶剂中经缩聚并流延成膜再经亚胺化而成。
聚酰亚胺薄膜具有优良的耐高低温性、电气绝缘性、粘结性、耐辐射性、耐介质性,能在-269℃~280℃的温度范围内长期使用,短时可达到400℃的高温。
被称为“黄金薄膜”的聚酰亚胺薄膜具有卓越的性能,它广泛的应用于空间技术、F、H级电机、电器的绝缘、FPC(柔性印刷线路板)、TAB(压敏胶带基材)、航天、
航空、计算机、电磁线、变压器、音响、手机、电脑、冶炼、采矿电子元器件工业、汽车、交通运输、原子能工业等电子电器行业。
* Upilex is a registered trademark in Japan and other countries of sale.
Upilex®-S delivers outstanding mechanical characteristics across a wide temperature range. It also demonstrates high tensile strength and modulus, and even
features outstanding long-term heat resistance. Another exceptional feature of Upilex®-S is its high resistance to hydrolysis, as demonstrated by its properties
being virtually unaffected even when it is immersed in boiling water for long periods of time.
* Upilex is a registered trademark in Japan and other countries of sale.
Upilex®-S delivers outstanding mechanical characteristics across a wide temperature range. It also demonstrates high tensile strength and modulus, and even
features outstanding long-term heat resistance. Another exceptional feature of Upilex®-S is its high resistance to hydrolysis, as demonstrated by its properties
being virtually unaffected even when it is immersed in boiling water for long periods of time.
Property | Unit | Characteristic value | Test method | |||||
---|---|---|---|---|---|---|---|---|
Upilex®-25S | Upilex®-75S | |||||||
-269°C | -196°C | 25°C | 300°C | 25°C | 200°C | |||
Tensile strength | MPa | 735 | 647 | 520 | 290 | 360 | 270 | ASTM D882 |
Stress at 5% elongation | MPa | - | - | 260 | 90 | 210 | 110 | ASTM D882 |
Elongation | % | 10 | 15 | 42 | 67 | 50 | 80 | ASTM D882 |
Tensile modulus | MPa | - | - | 9,100 | 3,700 | 6,900 | 3,800 | ASTM D882 |
Tear strength-initiation [Graves] | N | - | - | 230 | - | 290 | - | ASTM D1004 |
Tear strength-propagation [Elmendorf] | N | - | - | 3.2 | - | 4.2 | - | ASTM D1922 |
Folding endurance [MIT] | Cycles | - | - | >100,000 | - | >25,000 | - | ASTM D2176 |
Density | ×103kg/ m3 | - | - | 1.47 | - | 1.47 | - | ASTM D1505 |
Coefficient of kinetic friction (film-to-film) | - | - | - | 0.4 | - | 0.4 | - | ASTM D1894 |
Upilex®-S exhibits excellent electrical characteristics over a wide range of temperatures and frequencies. Even at high temperatures, Upilex®-S shows almost
no deterioration in its electrical properties, unlike other plastic-type films. It also displays a low level of electrical insulation defects, making it an optimal choice
for electrical and electronic uses that demand high reliability.
Property | Unit | Characteristic value | Test conditions | Test method | |||
---|---|---|---|---|---|---|---|
Upilex®-25S | Upilex®-75S | ||||||
25°C | 200°C | 25°C | 200°C | ||||
Dielectric strength | kV | 6.8 | 6.8 | 11 | 11 | 50Hz | ASTM D149 |
Dielectric constant | - | 3.5 | 3.3 | 3.3 | 3.2 | 1kHz | ASTM D150 |
Dissipation factor | - | 0.0013 | 0.0078 | 0.0038 | 0.0056 | 1kHz | ASTM D150 |
Volume resistivity | Ωm | 1015 | 1013 | 1014 | 1014 | DC 100V | ASTM D257 |
Surface resistivity | Ω | >1017 | 1015 | >1016 | 1015 | DC 100V | ASTM D257 |
Upilex®-S boasts the highest heat resistance of any plastic film currently available. Its major features include a high starting temperature for thermal decomposition,
smaller values of both heat shrinkage and thermal linear expansion coefficients, as well as flame resistance (UL94 VTM-0). Therefore, Upilex®-S varies little in size even
when heated. This makes it ideal for use in FPC and TAB-tape substrates composed of minute circuits.
Property | Unit | Characteristic value | Test condition (test method) | ||
---|---|---|---|---|---|
Upilex®-25S | Upilex®-75S | ||||
Heat shrinkage | % | 0.1 | 0.01 | 200°C, 2 hours, ASTM D1204 | |
Thermal linear expansion coefficient (50-200°C) | ppm/K | 12 | 20 | Values determined by minute linear expansion tester at 5°C/min. temperature increments | |
Melting point | °C | None | |||
Specific heat | kJ/(kg·K) | 1.13 | Differential scanning calorimeter | ||
Temperature index | °C | 290 | Heat treatment: 20,000 hours | ||
Non-flammability | - | UL94VTM-0 (Exceeding 7.5 μm) | UL94 File No. 48133 | ||
Oxygen index | % | 66 | JIS K7201 | ||
Thermal conductivity | W/(m·K) | 0.290 | Laser flash method |
Upilex®-S is insoluble in all organic solvents and is sufficiently resistant to virtually any chemical, including inorganic acid and alkali solution. This chemical resistance provides
exceptional physical properties as well as superior dimensional stability when Upilex®-S exposed to chemicals.
Property | Characteristic value (Upilex-®-S) | Test condition | Test method | |||
---|---|---|---|---|---|---|
Strength retained (%) | Elongation retained (%) | Modulus retained (%) | ||||
Resistance to: | ASTM D882 | |||||
10% sodium hydroxide | 80 | 60 | 95 | Immersion at 25°C for 5 days | ||
Glacial acetic acid | 100 | 95 | 100 | Immersion at 110°C for 5 weeks | ||
Water | PH=1.0 | 95 | 85 | 100 | Immersion at 100°C for 2 weeks | |
PH=4.2 | 95 | 85 | 100 | Immersion at 100°C for 2 weeks | ||
PH=8.9 | 95 | 85 | 100 | Immersion at 100°C for 2 weeks | ||
PH=10.0 | 95 | 85 | 100 | Immersion at 100°C for 4 days | ||
Water absorption | 1.4% | Immersion in water at 23°C for 24 hours | ASTM D570 | |||
0.8% | Immersion in water at 23°C for 24 hours | |||||
Gas permeability | ||||||
Water vapor | 1.7×10-3kg/m2/25μm | 38°C, 90% RH for 24 hours | ASTM E96 | |||
Oxygen | 0.8×10-6m3/m2/25μm | 30°C, 1 atm for 24 hours | ASTM D1434 | |||
Carbon dioxide | 1.2×10-3m3/m2/25μm | 30°C, 1 atm for 24 hours | ASTM D1434 |
Upilex®-S features low water absorption and hygroscopic expansion. Another advantage inherent in Upilex®-S is its low absorption/desorption speeds. All these combine
to delivery high dimensional stability even when moisture is absorbed. It also delivers exceptional weather resistance as shown in the figures below.
Property | Unit | Upilex®-S | Conventional polyimide | Polyester | Polysulfone | Polytetra fluoroethylene |
---|---|---|---|---|---|---|
Density | g/cm3 | 1.47 | 1.42 | 1.38-1.41 | 1.24-1.25 | 2.1-2.2 |
Tensile strength | MPa | 520 | 173 | 137-245 | 58-74 | 11-31 |
Elongation | % | 42 | 70 | 60-170 | 60-110 | 100-400 |
Tensile modulus | MPa | 9,120 | 2,961 | - | - | - |
Tear strength-initiation (Graves) | N | 226 | 197 | 177-530 | 39 | - |
Tear strength-propagation | N | 3.24 | 3.14 | 4.90-10.79 | 3.92-4.90 | 3.92 |
Resistance to organic solvents | - | Excellent | Excellent | Excellent | Excellent | Excellent |
Resistance to strong acids | - | Good | Good | Good | Excellent | Excellent |
Resistance to strong alkalis | - | Good | Poor | Good | Excellent | Excellent |
Dielectric constant | - | 3.5 | 3.5 | 3.2 | 3.1 | 2.1 |
Dissipation factor | - | 0.0013 | 0.003 | 0.005 | 0.0008 | 0.0002 |
(Modern Plastics Encyclopedia)
Property | Grade | Thickness (μm) | Width (mm) | Area factor (m2/kg) |
---|---|---|---|---|
Upilex®-S | ||||
12.5SN | 12.5 | 508/1,016 | 54.4 | |
25S | 25 | 508/1,016 | 27.2 | |
50S | 50 | 508/1,016 | 13.6 | |
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(二)UPILEX®-NVT UPILEX®-VT
Super-heat resistant polyimide film produced from UBE’s exclusive “BPDA (Biphenyl tetracarboxylic dianhydride)“ monomers.
This formulation is unique to UBE and exhibits outstanding dimensional stability, low water absorption and very high chemical resistance.
“UPILEX®-VT” and ”UPILEX®-NVT” are heat bonding polyimide films having heat fusing layers on both side of the film, created by the polyimide resin equivalent of “UPILEX®-S”.
High quality flflexible circuits without an adhesive layer are obtained, by heating and pressing “UPILEX®-VT” or ”UPILEX®-NVT” with metal (Cu, SUS, Al) foil.
In addition, they are also available for bonding films comprised of metal, ceramic and other materials.
●Flexible circuits without adhesive are produced.
●This offers high tensile strength and tear strength.
●Offering the same low water absorption, low dimensional change and high heat resistance as “UPILEX®-S”, with the addition of laminate workability in the heat press.